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手持式光譜儀手持式合金分析儀合金分析儀

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手持式光譜儀手持式合金分析儀合金分析儀

XRF

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Plating Thickness Analyzer

Type:Thick 8000
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Product description, Technical parameters and configuration

Thick 8000 Plating Thickness Analyzer is a newly launched high-end spectrometer especially designed for plating thickness measurement. It is widely applied to measure the thickness of metal plating, the content of electroplating bath and plating, the content of precious metals like Au, Pt, Ag, etc.

Features

1.Precise 3D platform;
2.Use of Lan connector;
3.Excellent sample observation system;
4.Advanced image identification;
5.Easy detection of sample with deep groove;
6.Four micro-focus collimators allowing automatic switch;
7.Double safeguard procedures to realize seamless anticollision;
8.Large area high resolution detector, effectively reducing detection limit and improving test accuracy.

Automatic intelligent control mode, one-click operation
Automatic self-check and reset when starting up;
Sample platform moves out and Z axis test platform rises after opening cover;
Sample platform moves in and Z axis test platform descends after closing cover to complete auto-focus;
Choose test points by clicking on full view or local view directly.
Click test button to start test and show test results

Technical Specifications

Analytical range: from S to U
Plating thickness: generally within 20um (it varies from material to material)
Repeatability: 0.1%
Stability: 0.1%
SDD detector: resolution as low as 135eV 
Sample observation: two industrial level HD cameras (full view and local view)
Collimator: 0.3×0.05mm、Ф0.1mm、Ф0.2mm and Ф0.3mm
Size: 690(W)x 575(D)x 660(H)mm
Chamber size: 520(W)x 395(D)x150(H)mm
Working humidity: ≤70%
Working temperature: 15℃~30℃

CONTACT US

Call us for more information
800-9993-800
400-7102-888
Nonworking Hotline
139 1323 1381
leave us a message
Online Message
AS of webchat QR code


手持式光譜儀手持式合金分析儀合金分析儀
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